Hitachi, Ltd., Intel, and the National Institute of Advanced Industrial Science and Technology have begun joint research and development of silicon quantum computers utilizing Intel’s cutting-edge 1.8nm process, the Intel 18A. Behind this is the government’s 10 trillion yen public-private investment in the quantum field, as well as strong expectations for the silicon method, which aims to scale up by repurposing existing semiconductor manufacturing technologies.

The full overview of the silicon quantum computer development project

On July 22, 2026, the New Energy and Industrial Technology Development Organization (NEDO), a national research and development agency under the Ministry of Economy, Trade and Industry, officially decided to support the development of silicon quantum computers through Hitachi, Intel, and the National Institute of Advanced Industrial Science and Technology (AIST). This project was selected as part of NEDO’s “Post-5G Information and Communication System Infrastructure Enhancement Research and Development Project,” with the implementation period scheduled to run until March 2029. The main goal is to realize a ‘practical silicon quantum computer’ capable of rapidly handling complex problems that are difficult to solve with conventional computers. Hitachi has been conducting research on quantum technology since the 1990s and has been participating in moonshot-type research and development projects since fiscal 2020. This collaboration will merge Hitachi’s design and implementation technologies with Intel’s world-leading semiconductor manufacturing processes. This event symbolizes Japan’s transition from mere basic research to a stage of concrete hardware manufacturing with an eye toward industrial implementation.

Strengths of a development system integrating industry, government, and academia

In this joint development, the three parties have each divided their respective areas of expertise and established a system for organic collaboration. Intel will provide the project with its cutting-edge “Intel 18A” process technology, which also attracted attention at the VLSI symposium held in Hawaii. This process achieves miniaturization equivalent to 1.8nm and serves as an essential infrastructure for increasing the integration of qubits. In addition to designing quantum bit chips, Hitachi will be responsible for developing ‘3D mounting technology’ that stacks chips in three dimensions. This aims to resolve complex wiring issues that may arise in the future as the number of qubits increases. AIST, at its research base “G-QuAT” established in Tsukuba City, will play a role in establishing a cloud-based platform for external researchers to utilize their development results. The reason the government decided to provide massive support is the fact that world-class players have been gathered at every layer of technology, manufacturing, and operations. This strong lineup will serve as a driving force to enhance Japan’s presence in the global quantum supremacy race.

[Technical Advantage] “Intel 18A” and 3D Implementation Are Key to Large-Scale

The potential of silicon methods that can repurpose existing semiconductor technologies

There are several technical approaches for quantum computers, such as superconducting and ionic methods, but silicon methods are considered one of the most promising candidates for future large-scale applications. The main reason is that existing silicon semiconductor manufacturing technologies and factory facilities, which have evolved for smartphones and PCs, can be directly repurposed for producing qubits. To realize error-tolerant general-purpose quantum computers capable of error correction, an integration of one million qubits is required. However, the silicon method has extremely small qubits compared to other methods, making it highly compatible with modern semiconductor lithography technologies capable of fine processing. Intel’s “Intel 18A” process employs a full-circuit gate structure called RibbonFET and PowerVia technology that supplies power from the back of the board, improving computing performance by about 9% and heat dissipation performance by over 20% compared to conventional processes. By applying these cutting-edge technologies to quantum chip manufacturing, it becomes possible to mass-produce high-precision chips that can stably maintain delicate quantum states.

Solving wiring issues through Hitachi’s 3D mounting technology

The biggest barrier to increasing the integration of qubits is the extensive wiring within the cooling system. As the number of qubits increases, control wiring becomes more complex, and conventional planar layouts reach their limits. To overcome this challenge, Hitachi is developing a ‘3D mounting technology’ that vertically stacks multiple qubit chips. To use a house analogy, instead of expanding single-story houses horizontally, building multi-story condominiums is closer to efficiently packing functions into a limited area. As shown in the diagram below, three-dimensional implementation shortens wiring distances and minimizes signal delay and heat generation. Additionally, Hitachi possesses proprietary control circuit technology for rapidly and highly accurate reading of the spin state of silicon qubits, and by manufacturing it using Intel’s 1.8nm process, it plans to simultaneously achieve both miniaturization and higher performance for the entire chip. This fusion of 3D implementation and cutting-edge processes is precisely the competitive advantage unique to silicon methods, which cannot be replicated by other methods.

[Background of Management Strategy] Hitachi’s ‘Counterattack’ and Intel’s Revival

Hitachi, which has withdrawn from semiconductor manufacturing, takes on the challenge of ‘re-entering with quantum technology’

For Hitachi, this project represents a major challenge in its semiconductor hardware business. Hitachi was once one of the world’s leading semiconductor manufacturers, but in 2014, it completely withdrew from in-house semiconductor manufacturing. However, even after leaving manufacturing, the talented semiconductor engineers who remained at Hitachi shifted their focus to quantum computer research, steadily sowing the seeds of the technology. Hitachi’s management plan “Inspire 2027” places “Physical AI,” which integrates digital technology with physical social infrastructure, as well as next-generation computing infrastructure, as pillars of growth, with quantum computers positioned as core technologies. From a fabless position without its own factories, Hitachi aims to bring its former semiconductor empire’s expertise to the new quantum continent by gaining Intel’s strongest manufacturing partner. This is not just about technological development, but rather a national-level comeback story aimed at redefining the engineering capabilities cultivated by Japanese manufacturing and regaining leadership in the global market.

Reviving Intel’s Foundry Business and Developing Advanced Customers

On the other hand, for Intel, collaboration with Hitachi and AIST is an extremely important step toward reviving its “foundry (contract manufacturing) business.” Intel is currently pursuing a strategy to establish itself as a “TSMC alternative candidate” by 2028 to challenge TSMC, which is leading in advanced process technology. The company’s “Intel 18A” process serves as a touchstone node for gaining trust from external customers. The current yield of 18A is reported to be around 50%, but at the Q2 2026 earnings call, the company has expanded capital investment to over $20 billion, clearly demonstrating its commitment to meeting AI and quantum demand. There are also predictions that Google has already ordered 3 million TPUs from Intel for 2028 production, and the quantum chip development with Hitachi serves as a showcase to prove its technical reliability. If Intel can demonstrate its 18A process capabilities in the field of quantum computers, which demands ultimate microfabrication, Intel’s dominance in the next-generation computing market will once again be solid.

[National Strategy] National Policy Surrounding the 10 Trillion Yen Scale of ‘Quantum Hegemony’

10.3 trillion yen investment by fiscal year 2040 set by the Japanese government

Japan’s quantum strategy has been elevated to an unprecedented scale of national policy. The current administration has selected quantum as one of its ’17 strategic areas’ and has presented a roadmap projecting a massive investment of 10.3 trillion yen from both public and private sectors by fiscal year 2040. Until now, Japan has been behind major American IT giants like IBM, Google, and Microsoft in quantum computer development, and it is undeniable that it has fallen behind. However, in the silicon method, which is considered the next-generation mainstream, Japan’s long-accumulated silicon semiconductor design and precise mounting technologies will be a major asset. The government’s swift decision to support the Hitachi-Intel alliance stems from positioning this field as a “game changer for industry and society,” and a strong desire to ensure the autonomy of domestic technologies in next-generation computers. Toward the goal of “realizing error-tolerant general-purpose quantum computers” set by 2050, the support from this NEDO project marks the first step for Japan’s industry to fully enter the unexplored field of quantum hardware manufacturing.

Massive Contributions to the Quantum Industry under the US ‘CHIPS Plus Act’

The massive investment movement surrounding quantum computers is a global trend that extends beyond Japan. In May 2026, the U.S. Department of Commerce announced its intention to contribute over $2 billion (approximately 310 billion yen) to nine U.S. domestic companies related to quantum computing under the CHIPS and Science Act (CHIPS Plus Act). This includes $1 billion invested in IBM’s establishment of a quantum-grade superconducting wafer manufacturing facility, as well as support for various quantum architecture manufacturing facilities by GlobalFoundries, including silicon spins. The reason the U.S. government is investing such massive sums is because quantum technology is a strategic technology directly linked to national security in defense, biopharmaceuticals, finance, and energy. This policy has continued under the Trump administration, and the collaboration between Hitachi and Intel sits at the intersection of these national policies of both countries. On the common playing field of silicon technology, the integration of Japanese and U.S. capital and technology is extremely important for ensuring technological resilience against competitors such as China.

[Future Developments] Toward Realizing 1000 Qubits by 2030

Specific development milestones set

Projects by Hitachi, Intel, and AIST have set clear timeline goals for practical application. First, within fiscal 2027, through AIST’s “G-QuAT,” the developed silicon quantum computer will be made available to external researchers in the cloud, establishing a foundation to promote software and application development. In fiscal year 2028, a prototype at the scale of 100 qubits capable of verifying error correction effectiveness will be realized, and by fiscal year 2030, the plan is to scale up to the 1000 qubit scale, which serves as a practical guideline. This ecosystem, led by AIST, is expected to accelerate concrete industrial applications such as material development, drug discovery, and logistics optimization. Until now, “Quantum Made in Japan” has mainly focused on software such as algorithms, but if this project succeeds, it will directly leverage Japan’s manufacturing strengths in “making the hardware itself.” Investors and industry need to closely monitor whether these annual targets are achieved as a key indicator of project progress.

Yield and Error Correction Barriers Toward Practical Application

Beyond the ambitious roadmap, high technical barriers still stand in the way. The biggest challenge is balancing the “quality” and “quantity” of qubits. To achieve large-scale operations of 1,000 qubits or even 1,000,000 qubits, it is essential to maximize the operational accuracy (fidelity) of each qubit and correct errors occurring during computation. Currently, RIKEN and AIST’s projects have achieved results such as achieving 99.9% fidelity for a single qubit, but there are still many hurdles to achieve stable control of several thousand bits simultaneously and to commercially achieve yield when mass-produced with Intel’s 1.8nm process. As shown in the figure below, the expansion of qubits is progressing year by year, but achieving “breakeven” to acquire error tolerance is still in its early stages. However, precisely controlling this delicate silicon structure is the true strength of Japanese companies specializing in precision manufacturing. With Hitachi’s 3D mounting technology breaking through wiring barriers and Intel’s miniaturization technology supporting mass bit production, there is ample potential for silicon methods to stage a dramatic comeback.

Reference Page

• 【Hitachi Official Press Release】https://www.hitachi.com/content/dam/hitachi/global/en/press/files/2026/07/260722a.pdf

• 【Intel 18A Process Node Platform Brief】https://www.intel.com/content/www/us/en/foundry/process-technology/18a.html

• [NEDO Post-5G Information and Communication System Infrastructure Enhancement Research and Development Project]https://www.nedo.go.jp/activities/ZZJP_100172.html

• [AIST: Research and Development of Quantum Computing Devices https://www.aist.go.jp/aist_j/press_release/pr2026/pr20260722/pr20260722.html

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